SCIE
MICROELECTRONICS INTERNATIONAL
Publisher information is not available.
Identifiers, indexing coverage, and citation metrics for the academic journal MICROELECTRONICS INTERNATIONAL. Identifiers: ISSN 1356-5362, eISSN 1758-812X. Indexed in SCIE. Subject areas: ELECTRICAL & ELECTRONIC, ENGINEERING, MATERIALS SCIENCE, MULTIDISCIPLINARY. tlooto lists 1,116 papers from this journal.
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Journal profile
- ISSN
- 1356-5362
- eISSN
- 1758-812X
- Abbreviation
- -
- Publisher
- -
- Country
- -
Web of Science categories
SCIEELECTRICAL & ELECTRONIC, ENGINEERING, MATERIALS SCIENCE, MULTIDISCIPLINARY
Scopus ASJC categories
No ASJC category data available.
Keywords
Engineering, Electrical & Electronic | Materials Science, Multidisciplinary
Papers in this journal
Recent papers
- Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics
2026
- Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback
2026
- Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
2026
- Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide
2026
- Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
2026 · 1 citations
Most cited papers
- Overview and outlook of through‐silicon via (TSV) and 3D integrations
2011 · 313 citations
- Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
2003 · 171 citations
- Using LTCC for microsystems
2002 · 90 citations
- The Theoretical Fundamentals of the Screen Printing Process
1989 · 77 citations
- Wire bonding using copper wire
2009 · 72 citations