SCIEQ2
IEEE Transactions on Components Packaging and Manufacturing Technology
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
IEEE Transactions on Components Packaging and Manufacturing Technology은(는) IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC에서 발행하는 학술지입니다. 식별자: ISSN 2156-3950, eISSN 2156-3985. SCIE에 등재되어 있습니다. 지표: JIF 3.0. 주제 분야: ELECTRICAL & ELECTRONIC, ENGINEERING, MANUFACTURING, MATERIALS SCIENCE. tlooto에서 이 학술지의 논문 4,272편을 볼 수 있습니다.
CiteScore
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Scopus 인용 지표
SJR
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SCImago 저널 순위
SNIP
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분야 보정 인용 영향력
Percentage rank
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JIF 백분위 순위
저널 기본 정보
- ISSN
- 2156-3950
- eISSN
- 2156-3985
- 약어
- IEEE T COMP PACK MAN
- 출판사
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- 국가
- -
Web of Science 카테고리
SCIEELECTRICAL & ELECTRONIC, ENGINEERING, MANUFACTURING, MATERIALS SCIENCE, MULTIDISCIPLINARY
Scopus ASJC 카테고리
ASJC 카테고리 정보가 없습니다.
키워드
Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary
이 학술지의 논문
최근 논문
- A Machine Learning-Based Prediction Method for Manufacturing Tolerances in Multilayer Circuit
2026
- Investigation on Warpage Characteristics for Ultralarge MCM FCBGA Package Based on Material-Structure Codesign and Intelligent Optimization
2026 · 인용 1회
- Collective Die-to-Wafer Bonding Enabling Low-Loss Evanescent Coupling for Optically Interconnected System-on-Wafer
2026
- Reactive Bonding of LTCC Substrates Using Different Types of Nanolayer Stacks
2026
- Advanced Packaging of Conformal Wideband Antennas for UAVs With Optimized RCS Reduction
2026 · 인용 1회
많이 인용된 논문
- Recent Advances and Trends in Advanced Packaging
2022 · 인용 488회
- High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
2011 · 인용 480회
- Die Attach Materials for High Temperature Applications: A Review
2011 · 인용 442회
- 3-D Printed Metal-Pipe Rectangular Waveguides
2015 · 인용 298회
- Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
2012 · 인용 251회