SCIEQ2
IEEE Transactions on Components Packaging and Manufacturing Technology
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
IEEE Transactions on Components Packaging and Manufacturing Technology is an academic journal published by IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC. Identifiers: ISSN 2156-3950, eISSN 2156-3985. Indexed in SCIE. Metrics: JIF 3.0. Subject areas: ELECTRICAL & ELECTRONIC, ENGINEERING, MANUFACTURING, MATERIALS SCIENCE. tlooto lists 4,272 papers from this journal.
CiteScore
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Journal profile
- ISSN
- 2156-3950
- eISSN
- 2156-3985
- Abbreviation
- IEEE T COMP PACK MAN
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Country
- -
Web of Science categories
SCIEELECTRICAL & ELECTRONIC, ENGINEERING, MANUFACTURING, MATERIALS SCIENCE, MULTIDISCIPLINARY
Scopus ASJC categories
No ASJC category data available.
Keywords
Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary
Papers in this journal
Recent papers
- A Machine Learning-Based Prediction Method for Manufacturing Tolerances in Multilayer Circuit
2026
- Investigation on Warpage Characteristics for Ultralarge MCM FCBGA Package Based on Material-Structure Codesign and Intelligent Optimization
2026 · 1 citations
- Collective Die-to-Wafer Bonding Enabling Low-Loss Evanescent Coupling for Optically Interconnected System-on-Wafer
2026
- Reactive Bonding of LTCC Substrates Using Different Types of Nanolayer Stacks
2026
- Advanced Packaging of Conformal Wideband Antennas for UAVs With Optimized RCS Reduction
2026 · 1 citations
Most cited papers
- Recent Advances and Trends in Advanced Packaging
2022 · 488 citations
- High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
2011 · 480 citations
- Die Attach Materials for High Temperature Applications: A Review
2011 · 442 citations
- 3-D Printed Metal-Pipe Rectangular Waveguides
2015 · 298 citations
- Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
2012 · 251 citations