SCOPUS
Journal of Micromechanics and Molecular Physics
World Scientific, Singapore
Journal of Micromechanics and Molecular Physics is an academic journal published by World Scientific (Singapore). Identifiers: ISSN 2424-9130, eISSN 2424-9149. Indexed in SCOPUS. Metrics: CiteScore 2.9, SJR 0.287, SNIP 0.57. tlooto lists 134 papers from this journal.
CiteScore
2.90
Scopus citation metric
SJR
0.287
SCImago rank
SNIP
0.57
Source normalized impact
Percentage rank
-
JIF percentile rank
Journal profile
- ISSN
- 2424-9130
- eISSN
- 2424-9149
- Abbreviation
- -
- Publisher
- World Scientific
- Country
- Singapore
Web of Science categories
No Web of Science category data available.
Scopus ASJC categories
2211 Mechanics of Materials2503 Ceramics and Composites2507 Polymers and Plastics3107 Atomic and Molecular Physics
Papers in this journal
Recent papers
- Spatial structure of the rubiscolin-6 molecule
2026
- Inverse degree-based topological indices for QSPR modelling of anti-babesiosis drugs: A computational approach
2026
- Computational Approaches in Drug Design: Study Quantitative Structure-Property Relationship of Organotin(IV) Carboxylates
2026
- Temperature-dependent relaxation dynamics in sintered sodium silicate: A CIS approach
2026
- Adaptive coupling of Buckingham–Coulomb potential for double porous microresonator with smart hollow core for biomolecule nanomass detection
2026
Most cited papers
- The review of the bond-based peridynamics modeling
2019 · 40 citations
- Martensite decomposition during post-heat treatments and the aging response of near-α Ti–6Al–2Sn–4Zr–2Mo (Ti-6242) titanium alloy processed by selective laser melting (SLM)
2021 · 35 citations
- On Mindlin’s isotropic strain gradient elasticity: Green tensors, regularization, and operator-split
2018 · 25 citations
- Additive manufacturing of hydroxyapatite and its composite materials: A review
2020 · 24 citations
- Bonding performance and mechanism of a heat-resistant composite precursor adhesive (RT-1000∘C) for TC4 titanium alloy
2020 · 23 citations