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Plasma Diagnostics and ApplicationsAdvancements in Semiconductor Devices and Circuit DesignSilicon and Solar Cell Technologies

Regulation of silicon bottom corner flatness through multi-parameter collaborative optimization in deep reactive ion etching

Ting Liang, Dandan Wang, Cheng Lei, Pengfei Ji, Xiangyang Ren, Renzhi Yuan

2026.4.13Journal of Micro-Nanopatterning Materials and Metrology-JM3

DOI: 10.1117/1.jmm.25.2.023601

Abstract

Abstract is not available.

Citation format

LIANG, Ting, et al. Regulation of silicon bottom corner flatness through multi-parameter collaborative optimization in deep reactive ion etching. Journal of Micro-Nanopatterning Materials and Metrology-JM3, 2026, 25(02).