Electrodeposition and Electroless CoatingsCopper Interconnects and Reliability3D IC and TSV technologies
Decheng Li, Xiaodong Li, Jianyu Liu, Yi Wang, Qian Wang, Yilei Yue, Song Lin, Linan Xu, Shirong Wang
Abstract
Abstract is not available.
Citation format
LI, Decheng, et al. Chain length effect of accelerators in TSV/TGV microvia copper filling: A combined DFT and MD simulation study. Computational and Theoretical Chemistry, 2026, 1262: 115858.