Lei Xie, Tao Zhang, Shengrui Xu, Huake Su, Hongchang Tao, Xiangdong Li, Longyang Yu, Z. Ren, Weidong Zhu, Yuan Gao, Xu Liu, Xinhao Wang, Yue Hao, Jincheng Zhang
2026.3.16APPLIED PHYSICS LETTERS
Abstract
In this work, AlGaN/GaN reverse conduction HEMTs (RC-HEMTs) integrated with anti-parallel Schottky barrier diodes (SBDs) are demonstrated. Benefiting from the idealized Schottky interface of AlGaN/GaN SBDs with recessed anode, which enables direct contact between GaN channel and anode metal, low reverse turn-on voltage (VR-T) of −0.75 V and high ION/IOFF ratio of 8.5 × 107 are obtained. Based on the randomly measured 100 RC-HEMTs with LGD of 15 μm, ultra-high VR-T uniformity with standard deviation of 18 mV and forward on-resistance (RON) uniformity with standard deviation of 0.3 Ω mm are calculated, respectively. Furthermore, the breakdown voltage of the fabricated AlGaN/GaN RC-HEMT with a 30-μm LGD can reach 2.7 kV, which shows great promise for medium-voltage power applications.
Citation format
XIE, Lei, et al. A 2.7 kv algan/gan high electron mobility transistor with an anti-parallel low turn-on voltage gan schottky barrier diode. APPLIED PHYSICS LETTERS, 2026, 128(11).