GaN-based semiconductor devices and materialsThin-Film Transistor TechnologiesEnergetic Materials and Combustion

O. Liudvichenko, O. Lyeshchuk, I. Petrusha, S. O. Gordieiev, B. Sadovyi, P. Sadovyi, Y. Sadova, A. Nikolenko, V. Turkevych, S. Porowski, I. Grzegory

2026.2.1Journal of Superhard Materials

DOI: 10.3103/s1063457626010144

Abstract

Using computational modeling, we optimized the resistive heating process of the high-pressure apparatus (HPA) cell designed for the growth of GaN crystals from the Fe–Ga–N solution-melt under high-pressure and high-temperature (HPHT) conditions via the temperature gradient method. The thermal state of the apparatus was simulated by solving the coupled electro- and heat-conduction problem using the finite element method. Modeling determined the spatial distribution of temperature and temperature gradient within the experimental cell. As a result of computational optimization of the thermal state of the toroid-40 type HPA cell, polycrystalline GaN was synthesized from the Fe–Ga–N solution-melt. Reducing the axial temperature gradient in the crystallization volume from 13 to 1.5°C/mm produced the growth of petal-shaped GaN single crystals. Observed crystal growth rates varied from 40 to 250 µm/h.

Citation format

LIUDVICHENKO, O., et al. High-pressure high-temperature crystallization of gan: Modeling and experimental studies. Journal of Superhard Materials, 2026, 48(1): 43–55.