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Lightning and Electromagnetic PhenomenaElectromagnetic Compatibility and Noise SuppressionElectromagnetic Compatibility and Measurements

EMC Simulation Model Considering Wire Harness Branching, Bundling, and Routing

A. Shiga

2026.3.1Journal of Japan Institute of Electronics Packaging

DOI: 10.5104/jiep.29.157

Abstract

Abstract is not available.

Citation format

SHIGA, A. EMC simulation model considering wire harness branching, bundling, and routing. Journal of Japan Institute of Electronics Packaging, 2026, 29(2): 157–163.