Evolution of Microstructure and Properties of Al Wires after Drawing Deformation and Annealing

The evolution of the microstructure (grain size, texture and dislocation density, etc.) was studied by the electron backscatter diffraction method, and its effect on the mechanical and electrical properties of aluminum wire after drawing with different degrees of deformation and subsequent annealing at 315°C for 1.5 h was investigated. It was found that with an increase in the degree of deformation of the aluminum wire, the grain size and the Schmidt factor (SF) in the structure decrease, the preferred orientation of $$\langle 111\rangle $$ is formed, and the dislocation density and yield strength (YS) increase. After annealing, the $$\langle 111\rangle $$ crystalline orientation disappears, the grain size and SF value increase, the dislocation density decreases, which leads to an increase in the elongation (EL) and electrical conductivity (EC) of the material. The highest set of properties of the wire is achieved after a deformation of 70% (YS = 142.81 MPa, EL = 7.34% and EC = 61.36% IACS). Although YS decreases after annealing, EL and EC increase by 113% and 1.5%, respectively. Quantitative calculation of the contribution of various strengthening effects (fine grain, dislocation and texture strengthening) showed that grain refinement strengthening makes a significant contribution (up to 57%) to the YS of aluminum wire.