Electrical and Thermal Properties of MaterialsSilicon Carbide Semiconductor Technologies3D IC and TSV technologies

Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package

Ge Shi, Zhongbo Yu, Zheng Xu, Xingyao Zeng, Y. Dai, Fei Qin, Hai Bo Zhang

2026.2.1MICROELECTRONICS RELIABILITY

DOI: 10.1016/j.microrel.2025.115992

Abstract

Abstract is not available.

Citation format

SHI, Ge, et al. Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package. MICROELECTRONICS RELIABILITY, 2026, 177: 115992.