Electromagnetic wave absorption materialsDielectric materials and actuatorsMagnetic Properties and Synthesis of Ferrites

Syeda Javaria Kazmi, Muhammad Ehsaan, Muhammad Nadeem, U. Rehman, Sadia Manzoor, Shahzad Hussain

2026.1.6JOURNAL OF VINYL & ADDITIVE TECHNOLOGY

DOI: 10.1002/vnl.70067

Abstract

The rapid advancement of electronic and communication technologies has led to a significant increase in electromagnetic (EM) pollution, necessitating the development of efficient electromagnetic interference (EMI) shielding materials to mitigate adverse effects on both human health and electronic systems. In this study, a series of ternary nanocomposites comprising NiFe 2 O 4 @carbon nanotubes (NFO@CNTs) was synthesized via the solvothermal method. Subsequently, NiFe 2 O 4 @CNTs were incorporated into polyvinylidene fluoride (PVDF) to fabricate PVDF/NiFe 2 O 4 @CNTs composites. The CNTs content was varied from 1 to 5 wt.% w.r.t NiFe 2 O 4 to optimize electrical conductivity and impedance matching, while tuning the synthesis temperature. X‐ray diffraction (XRD) and Raman analysis confirmed the successful formation of NiFe 2 O 4 @CNTs composites, while transmission electron microscopy (TEM) images revealed the uniform functionalization of CNTs, the anchoring of NiFe 2 O 4 nanoparticles on CNTs walls, and the formation of a 3D conductive network. Ternary composite NTC10(5) exhibited maximum EMI shielding effectiveness (SE T ) of 16.20 dB, equivalent to 97.61% attenuation, which further increased to 22 dB (> 99% attenuation) upon optimizing the processing temperature to 100°C. Additionally, electromagnetic wave (EMW) absorption performance was evaluated by introducing a metallic backing layer. The NTC7(1) sample demonstrated the highest reflection loss (RL min ) of −30 dB, corresponding to greater than 99.9% EMW absorption.

Citation format

KAZMI, Syeda Javaria, et al. Temperature‐driven EMW absorption and EMI shielding via 3d conductive and magnetic–dielectric networks in pvdf/nife2o4@cnts. JOURNAL OF VINYL & ADDITIVE TECHNOLOGY, 2026, 32(3): 647–660.