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Interlocking Cu/Al bimetal with nickel layer bionic structure interface perpetrated by additive-casting hybrid process

Wenpeng Shi, Chenglong Bi, Hong Xu, Daqian Pang, Cheng Li, Q. Du, Bojun Li, Yu Wang

2026.1.1Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2025.185735

Abstract

Abstract is not available.

Citation format

SHI, Wenpeng, et al. Interlocking cu/al bimetal with nickel layer bionic structure interface perpetrated by additive-casting hybrid process. Journal of Alloys and Compounds, 2026, 1050: 185735.