Optical Readout Terahertz Stacked Metamaterial Array Chip

Array detection chip is one of the key components of terahertz (THz) systems, with important applications in nondestructive testing, perspective imaging, and high-speed communication. This letter proposes an optical readout THz stacked metamaterial array chip operating at a frequency near the atmospheric window (0.22 THz). It adopts the design of upper and lower chips separation and then bonding to achieve the stacked structure. The upper chip combines with metamaterial cantilever pixels to achieve sensing and execution functions, while the lower chip undertakes auxiliary and support functions. The incident THz radiation can be absorbed and converted to mechanical energy of pixels, then read out in parallel at high speed by the optical system. The stacked mechanism reduces the size and thickness of the sensing/execution structure and improves the radiation–thermal–mechanical sensitivity of the chip. Spectral measurements show that its absorptivity is 97%. Meanwhile, the time measurement results indicate that the chip can quickly respond to THz radiation, with a response time of 1.62 ms.