PhysicsChemistry
DOI: 10.25103/jestr.011.05

Abstract

Abstract: Phase separation may occur in a way that the growth is not in extent but in amplitude. Only in the unstable region such a procedure is thermodynamically feasible. In a phase diagram the unstable region is defined by the spinodal. When a system has crossed this locus, phase separation occurs spontaneously without the presence of a nucleation step. This process is known as spinodal decomposition and commonly results to a high interconnectivity of the two phases. The Cahn-Hilliard equation describes the kinetics of the process. In this note both processes (nucleation and spinodal) are depicted schematically. Abstract Abstract: Phase separation may occur in a way that the growth is not in extent but in amplitude. Only in the unstable region such a procedure is thermodynamically feasible. In a phase diagram the unstable region is defined by the spinodal. When a system has crossed this locus, phase separation occurs spontaneously without the presence of a nucleation step. This process is known as spinodal decomposition and commonly results to a high interconnectivity of the two phases. The Cahn-Hilliard equation describes the kinetics of the process. In this note both processes (nucleation and spinodal) are depicted schematically. Abstract Abstract: Phase separation may occur in a way that the growth is not in extent but in amplitude. Only in the unstable region such a procedure is thermodynamically feasible. In a phase diagram the unstable region is defined by the spinodal. When a system has crossed this locus, phase separation occurs spontaneously without the presence of a nucleation step. This process is known as spinodal decomposition and commonly results to a high interconnectivity of the two phases. The Cahn-Hilliard equation describes the kinetics of the process. In this note both processes (nucleation and spinodal) are depicted schematically.

Citation format

FAVVAS, E.; MITROPOULOS, A. What is spinodal decomposition. Journal of Engineering Science and Technology Review, 2008, 1: 25–27.