EngineeringMaterials Science
W. Lee, L. Nguyen, G. Selvaduray
2000.2.28MICROELECTRONICS RELIABILITY
Abstract
Abstract is not available.
Citation format
LEE, W.; NGUYEN, L.; SELVADURAY, G. Solder joint fatigue models: Review and applicability to chip scale packages. MICROELECTRONICS RELIABILITY, 2000, 40: 231–244.