L. Yeh
1995.12.1JOURNAL OF ELECTRONIC PACKAGING
Abstract
Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
Citation format
YEH, L. Review of heat transfer technologies in electronic equipment. JOURNAL OF ELECTRONIC PACKAGING, 1995, 117: 333–339.