Environmental ScienceEngineeringMaterials Science

Masayoshi Takahashi, H. Ishikawa, T. Asano, H. Horibe

2012.6.1JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY

DOI: 10.1021/jp301746g

Abstract

In this paper, we describe the use of ozone microbubbles in photoresist removal from silicon wafers. Ozonized water has attracted much attention as an environmental friendly cleaning method in semiconductor manufacturing. However, it would be desirable to enhance the oxidative ability of ozonized water for practical application. The existence of microbubbles in ozonized water has been shown to significantly enhance the photoresist removal rate due to an elevated dissolved ozone concentration (approximately 2.5 times that of ordinary ozone bubbling) and a direct effect of the microbubbles (removal rate is approximately 1.3 times faster than water with the same concentration of dissolved ozone without microbubbles). Additionally, the ozone microbubble solution was able to effectively remove a high-dose ion-implanted photoresist, which is extremely resistant to removal by ozonized water and other wet chemicals because of its amorphous carbon-like layer, or “crust”. Electron spin resonance experiments were al...

Citation format

TAKAHASHI, Masayoshi, et al. Effect of microbubbles on ozonized water for photoresist removal. JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2012, 28: 293–298.