Effect of processing conditions on the bonding quality of FDM polymer filaments

Purpose – The purpose of this paper is to investigate the mechanisms controlling the bond formation among extruded polymer filaments in the fused deposition modeling (FDM) process. The bonding phenomenon is thermally driven and ultimately determines the integrity and mechanical properties of the resultant prototypes.Design/methodology/approach – The bond quality was assessed through measuring and analyzing changes in the mesostructure and the degree of healing achieved at the interfaces between the adjoining polymer filaments. Experimental measurements of the temperature profiles were carried out for specimens produced under different processing conditions, and the effects on mesostructures and mechanical properties were observed. Parallel to the experimental work, predictions of the degree of bonding achieved during the filament deposition process were made based on the thermal analysis of extruded polymer filaments.Findings – Experimental results showed that the fabrication strategy, the envelope temper...