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EngineeringMaterials ScienceComputer Science

Liquid metal cooling in thermal management of computer chips

Kunquan Ma, Liu Jing

2007.12.5Frontiers in Energy

DOI: 10.1007/s11708-007-0057-3

tlooto Summary

Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling, and principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated.

Abstract

Abstract is not available.

Citation format

MA, Kunquan; JING, Liu. Liquid metal cooling in thermal management of computer chips. Frontiers in Energy, 2007, 1: 384–402.