Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review

Jianing Wang, Jieshi Chen, Lixia Zhang, Zhiyuan Zhang, Yuzhu Han, Xiaowu Hu, Hao Lu, Shu-ye Zhang

2022.7.1Journal of Advanced Joining Processes

DOI: 10.1016/j.jajp.2022.100125

Abstract

Abstract is not available.

Citation format

WANG, Jianing, et al. Forming mechanism and growth of kirkendall voids of sn/cu joints for electronic packaging: A recent review. Journal of Advanced Joining Processes, 2022.