EngineeringPhysicsComputer Science

C. Minkenberg, Rajagopal Krishnaswamy, A. Zilkie, David Nelson

2021.4.1IET Optoelectronics

DOI: 10.1049/ote2.12020

tlooto Summary

Co-packaged datacenter optics offer opportunities and challenges for high-capacity, high-density optical links, but their adoption faces trade-offs in cost, power efficiency, and network architecture.

Abstract

Cyriel Minkenberg, Rockley Photonics Ltd., 57 Woodstock Road, Oxford, OX2 6HJ, UK Email: cyriel.minkenberg@rockleyphotonics.com Abstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.

Citation format

MINKENBERG, C., et al. Co‐packaged datacenter optics: Opportunities and challenges. IET Optoelectronics, 2021.