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EngineeringMaterials Science

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

J. Lau, Ming Li, N. Fan, E. Kuah, Zhang Li, K. Tan, Tony Chen, Iris Xu, Margie Li, Y. Cheung, Wu Kai, J. Hao, R. Beica, Thomas Taylor, C. Ko, Henry Yang, Yao Chen, S. Lim, N. Lee, Jiang Ran, Koh Sau Wee, Q. Yong, Cao Xi, Mian Tao, J. Lo, Ricky S. W. Lee

2017.12.20Journal of Microelectronics and Electronic Packaging

DOI: 10.4071/imaps.522798

Abstract

Abstract is not available.

Citation format

LAU, J., et al. Fan-out wafer-level packaging (FOWLP) of large chip with multiple redistribution-layers (rdls). Journal of Microelectronics and Electronic Packaging, 2017, 14: 123–131.