SCIESCOPUSQ2
JOURNAL OF ELECTRONIC PACKAGING
ASME, United States
JOURNAL OF ELECTRONIC PACKAGING is an academic journal published by ASME (United States). Identifiers: ISSN 1043-7398, eISSN 1528-9044. Indexed in SCIE, SCOPUS. Metrics: JIF 2.3, CiteScore 5.7, SJR 0.524, SNIP 1.07. Subject areas: ELECTRICAL & ELECTRONIC, ENGINEERING, ENGINEERING, MECHANICAL, MECHANICAL. tlooto lists 2,162 papers from this journal.
CiteScore
5.70
Scopus citation metric
SJR
0.524
SCImago rank
SNIP
1.07
Source normalized impact
Percentage rank
-
JIF percentile rank
Journal profile
- ISSN
- 1043-7398
- eISSN
- 1528-9044
- Abbreviation
- J ELECTRON PACKAGING
- Publisher
- ASME
- Country
- United States
Web of Science categories
SCIEELECTRICAL & ELECTRONIC, ENGINEERING, MECHANICAL
Scopus ASJC categories
17062208 Electrical and Electronic Engineering2211 Mechanics of Materials2504 Electronic
Keywords
Engineering, Electrical & Electronic | Engineering, Mechanical
Papers in this journal
Recent papers
- Challenges In Co-Packaging Of SI-III/V Components In Silicon Photonics
2026
- System-Level Thermal Analysis of Two-Phase Direct-to-Chip Cooling for Data Centers with Chilled Facility Water
2026
- Thermomechanical Finite Element Analysis of Cu-SiCN Hybrid Bonding with Protruding and Recessed Cu Pad in 3D-IC
2026 · 1 citations
- A Hybrid FEA-Machine Learning-Generative AI (GANs) Framework for Predicting Reliability Risks in 3D IC Packaging
2026
- Using Data Center Waste Heat for Hydrogen Production
2026
Most cited papers
- Tribology and Mechanics of Magnetic Storage Devices
1990 · 788 citations
- Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
2001 · 336 citations
- Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations
2011 · 325 citations
- Review of Heat Transfer Technologies in Electronic Equipment
1995 · 278 citations
- Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
2002 · 274 citations