SCOPUS
Journal of Japan Institute of Electronics Packaging
The Japan Institute of Electronics Packaging, Japan
Journal of Japan Institute of Electronics Packaging is an academic journal published by The Japan Institute of Electronics Packaging (Japan). Identifiers: ISSN 1343-9677, eISSN 1884-121X. Indexed in SCOPUS. Metrics: CiteScore 0.1, SJR 0.160, SNIP 0.17. tlooto lists 2,828 papers from this journal.
CiteScore
0.10
Scopus citation metric
SJR
0.160
SCImago rank
SNIP
0.17
Source normalized impact
Percentage rank
-
JIF percentile rank
Journal profile
- ISSN
- 1343-9677
- eISSN
- 1884-121X
- Abbreviation
- -
- Publisher
- The Japan Institute of Electronics Packaging
- Country
- Japan
Web of Science categories
No Web of Science category data available.
Scopus ASJC categories
2208 Electrical and Electronic Engineering
Papers in this journal
Recent papers
- Proposal of Statistical Analysis Method of Common-Mode Current on Twisted Pair Line with Variations in Line Height and Deflection Using Polynomial Chaos Methods
2026
- Research Trends of Thermal Management
2026
- Plating Adhesion Design for Glass Core Substrate
2026
- Recent Trends in Optical Packaging Technologies
2026
- EMC Simulation Model Considering Wire Harness Branching, Bundling, and Routing
2026
Most cited papers
- Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
2002 · 46 citations
- FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules
2000 · 24 citations
- Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Packages Taking into Consideration of Chemical Shrinkage of Molding Compound
2004 · 23 citations
- Proposal and Investigation of Unbalanced Dipole Antenna With Semicircular and Trapezoidal Radiators for UWB Radio
2007 · 23 citations
- Electroless Copper Plating
1989 · 20 citations