SCOPUS
Journal of Japan Institute of Electronics Packaging
The Japan Institute of Electronics Packaging, Japan
Journal of Japan Institute of Electronics Packaging is an academic journal published by The Japan Institute of Electronics Packaging (Japan). Identifiers: ISSN 1343-9677, eISSN 1884-121X. Indexed in SCOPUS. Metrics: CiteScore 0.1, SJR 0.160, SNIP 0.17. tlooto lists 2,828 papers from this journal.
CiteScore
0.10
Métrica de citas de Scopus
SJR
0.160
Ranking SCImago
SNIP
0.17
Impacto normalizado por fuente
Rango percentil
-
Percentil del JIF
Perfil de la revista
- ISSN
- 1343-9677
- eISSN
- 1884-121X
- Abreviatura
- -
- Editorial
- The Japan Institute of Electronics Packaging
- País
- Japan
categorías de Web of Science
No hay datos de la categoría de Web of Science disponibles.
categorías ASJC de Scopus
2208 Electrical and Electronic Engineering
Papers in this journal
Recent papers
- Proposal of Statistical Analysis Method of Common-Mode Current on Twisted Pair Line with Variations in Line Height and Deflection Using Polynomial Chaos Methods
2026
- Research Trends of Thermal Management
2026
- Plating Adhesion Design for Glass Core Substrate
2026
- Recent Trends in Optical Packaging Technologies
2026
- EMC Simulation Model Considering Wire Harness Branching, Bundling, and Routing
2026
Most cited papers
- Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
2002 · 46 citations
- FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules
2000 · 24 citations
- Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Packages Taking into Consideration of Chemical Shrinkage of Molding Compound
2004 · 23 citations
- Proposal and Investigation of Unbalanced Dipole Antenna With Semicircular and Trapezoidal Radiators for UWB Radio
2007 · 23 citations
- Electroless Copper Plating
1989 · 20 citations