Integrated Circuits and Semiconductor Failure AnalysisAdvanced Electron Microscopy Techniques and ApplicationsElectron and X-Ray Spectroscopy Techniques
P. Limbecker, Rong Wu, Thomas Woyack, H. Stegmann, Daniel Plencner, R. Salzer
Abstract
This article looks at ways to automate FIB-SEM slice and view, dataset post-processing and visualization, and automated defect detection. Virtual slicing in all directions, especially in the top-down view, facilitates the interpretation of defect types and the identification of root causes. Automated slice and view capabilities can save resources and maximize tool utilization.
Citation format
LIMBECKER, P., et al. A step toward automation in failure analysis by FIB-SEM 3d tomography and AI segmentation. Electronic Device Failure Analysis, 2026, 28(1): 3–10.