SCOPUS
Journal of Microelectronics and Electronic Packaging
IMAPS-International Microelectronics and Packaging Society, United States
Journal of Microelectronics and Electronic Packaging is an academic journal published by IMAPS-International Microelectronics and Packaging Society (United States). Identifiers: ISSN 1551-4897, eISSN 1555-8037. Indexed in SCOPUS. Metrics: CiteScore 1.7, SJR 0.157, SNIP 0.49. tlooto lists 498 papers from this journal.
CiteScore
1.70
Scopus citation metric
SJR
0.157
SCImago rank
SNIP
0.49
Source normalized impact
Percentage rank
-
JIF percentile rank
Journal profile
- ISSN
- 1551-4897
- eISSN
- 1555-8037
- Abbreviation
- -
- Publisher
- IMAPS-International Microelectronics and Packaging Society
- Country
- United States
Web of Science categories
No Web of Science category data available.
Scopus ASJC categories
17052208 Electrical and Electronic Engineering2504 Electronic
Papers in this journal
Recent papers
- Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
2026
- Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
2026
- Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic Components
2026
- Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
2026
- Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
2026
Most cited papers
- Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)
2008 · 92 citations
- Redistribution Layers (RDLs) for 2.5D/3D IC Integration
2013 · 49 citations
- Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
2018 · 45 citations
- Recent Advances and Trends in Heterogeneous Integrations
2019 · 36 citations
- Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
2017 · 35 citations